| 1. | Random vibration analysis of stochastic antenna structures under wind excitation
风荷激励下天线结构的随机振动分析 |
| 2. | The probability density evolution method for compound random vibration analysis of stochastic structures
随机结构复合随机振动分析的概率密度演化方法 |
| 3. | And then , random vibration analyses are performed for both double - layer cylindrical lattice shells and single - layer cylindrical lattice shells to investigate their seismic performance under multiple seismic inputs
之后，对双层及单层柱面网壳的随机地震反应进行了详细分析。 |
| 4. | Then , the multidimensional pseudo excitation method is developed for nonstationary random vibration analysis of lattice shells under multi - support and multi - dimensional earthquake inputs
在此基础上，发展了多维随机虚拟激励算法的理论，推导出了考虑多点、非平稳输入时多维虚拟激励法的计算公式。 |
| 5. | The solution of the original nonlinear problem is reasonably approximated by means of a series of random vibration analyses for the linearized structure using the pseudo excitation method
本文方法充分利用了虚拟激励法求解复杂线性结构高效、精确的优点，以一系列线性问题的迭代分析，迅速地求得原非线性问题合理的近似解。 |
| 6. | Based on above research , a computer program has been developed for the random vibration analysis . the program is highly efficient and can deal with the influence of traveling wave effect and nonstationary seismic excitation
该程序可高效地对大型网壳进行多维随机响应分析，并可精确考虑行波效应和地震激励的非平稳性，其实用性很强。 |
| 7. | Finally , the random vibration analysis of the signal transform device is presented . experimental modal analysis is discussed briefly . the reasons why the relays on the printed circuit board were destroyed under random acceleration excitations are found out
本文最后对信号变换装置进行了随机振动响应分析，简要探讨了实验模态分析法，找出了装在印制电路板上的继电器在随机振动试验中被损坏的原因，也介绍了结构动力模型修正技术的发展。 |
| 8. | Modal analysis , frequency response analysis , random vibration analysis and vibration fatigue analysis are carried out based on the modified finite element model . the first natural frequency of pcb is 57 hz , and the dynamic response in the first natural frequency is the largest . weak points are also found
为分析该印制电路板可靠性及设计缺陷,需对修改过的有限元模型进行模态分析、频率响应分析、随机振动分析及疲劳寿命分析,以全面了解该印制电路板的动态特性(包括:印制电路板的固有频率、随机振动响应情况) ,以及存在的薄弱环节。 |
